KIOXIA will be at the Open Compute Project (OCP) Global Summit next week to highlight how high-performance flash storage can help data centers scale AI infrastructure. As organizations build out AI solutions, storage is becoming increasingly important to meeting the performance, capacity and efficiency demands of AI workloads and maximizing investments in AI.
As AI reshapes data center infrastructure, demand is growing for storage that can scale with increasingly data-intensive workloads. The next wave of AI inference will further expand these requirements across centralized, regional and edge environments. KIOXIA is developing high-performance flash storage solutions to help data centers meet these demands.
“KIOXIA is making game-changing high-performance flash storage solutions for AI infrastructure,” said Neville Ichhaporia, senior vice president and general manager of the SSD business unit at KIOXIA America, Inc. “As AI drives new performance demands, scalable, efficient storage becomes the foundation for innovation. We’re helping data centers build that foundation by pioneering storage solutions designed specifically for AI-driven infrastructure.”
Product and technology demonstrations can be seen at the KIOXIA booth #F9 on the show floor at the San Jose Convention Center from October 12-15.
Demonstrations include:
- Super High IOPS SSD for Near-GPU Workloads: featuring KIOXIA GP Series NVMe SSDs. KIOXIA will be showing a technology demonstration of an enhanced version of the KIOXIA GP Series SSD utilizing XL-FLASH generation 3. The demo will be showing 20+MIOPS 512-byte random read performance
- Liquid Cooled SSDs for AI: featuring KIOXIA NX1 Series E1.S NVMe SSDs for data centers
- High Density SSDs for Data Center Deployments: featuring KIOXIA LD4 Series E1.L NVMe SSDs
Additionally, KIOXIA is presenting an expo hall theater session titled, “Liquid Cooling Approaches for E1.S SSDs,” on Thursday, October 15 at 11:00 AM PT. The session will be presented by Paul Wu, Product Manager, Data Center SSDs for KIOXIA America, Inc., and will spotlight liquid-cooling approaches for E1.S SSDs, including KIOXIA’s collaboration through OCP activities and alignment with the SNIA® SFF-TA-1006 rev 2.0 specification.
